Reliability testing equipment for power semiconductor packaging.
The University of Strathclyde, on behalf of the National Centre for Advanced Semiconductor Packaging (NCASP), seeks to procure three reliability testing systems for power semiconductor devices: a climatic chamber for high temperature bias test, a climatic chamber for high temperature and high humidity bias test, and a thermal shock test chamber. This equipment is critical for ensuring packaged devices meet industry standards, supporting the UK's sovereign advanced semiconductor packaging capability. The tender is open to all suppliers capable of delivering and installing the specified equipment. The contract value is not disclosed, but the scale suggests a significant investment in national infrastructure.