Multichip Module Package for SiC Pressure Sensors

NASA's Shared Services Center, on behalf of the agency, is procuring a multichip module package for silicon carbide (SiC) pressure sensors. The requirement includes the design, fabrication, and delivery of custom multichip modules that integrate SiC pressure sensor dies with signal conditioning electronics. The modules must operate in high-temperature and harsh environments typical of aerospace applications. The solicitation is a combined synopsis/solicitation under NAICS 334419 (Other Electronic Component Manufacturing). The place of performance is Cleveland, Ohio. The contract value is not specified, but the specialized nature suggests a moderate to high complexity. No specific set-asides or certifications are mentioned.